Sunday, September 19, 2021
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Intel Accelerates Process And Packaging Innovations

Intel Launches RibbonFET and PowerVia technologies. The company also announced new naming structure for nodes.

In a recent press release, Intel Corporation announced its new roadmap towards process acceleration and groundbreaking packaging innovations. The company revealed its technologies that would power the upcoming products beyond 2025. 

Two new technologies were unveiled in the press release, which includes Intel’s new transistor architecture called RibbonFET and the world’s first backside power delivery technology named PowerVia. 

After a decade-long wait, Intel has come up with a new architecture technology for its processors. The company is also ready to launch its High Numerical Aperture Extreme Ultraviolet Lithography production technology. 

Read More: Intel Beats Its Revenue Estimate For Q3 In 2021

Senior Vice President and General Manager of technology at Intel, Dr. Ann Kelleher, said, “We led the transition to strained silicon at 90nm, to high-k metal gates at 45nm, and to FinFET at 22nm. Intel 20A will be another watershed moment in process technology with two groundbreaking innovations: RibbonFET and PowerVia.” 

She further added that Intel has a great history of foundational process innovations that have helped the industry grow by many folds. The chip manufacturing giant has come up with a new naming structure for its node that would allow customers to understand their products and their capabilities in a much easier manner. 

The fresh node names are Intel 7, Intel 4, Intel 3, and Intel 20A. The company is currently developing another node called Intel 18A and is expected to be launched in 2025. According to company officials, Amazon Web Services will be the first enterprise that would use Intel’s IFS packaging solutions and will also provide necessary insights. 

The firm also plans to collaborate with other players in the United States and Europe to continue research on more innovations as deep collaborative efforts in the ecosystem are essential for enabling high-volume manufacturing. 

Pat Gelsinger, the CEO of Intel, said, “Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025.”

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Dipayan Mitra
Dipayan is a news savvy writer, who does not leave a single page of news paper unturned. He is also a professional vocalist who enjoys ghazals. Building a dog shelter is his forever dream.

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